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Hot melt glue chips for packaging and bookbinding

Model No.
Hot melt glue chips for packaging and bookbinding
Made in
Taiwan
Supplier
GADEN CORPORATION
Request for Quotation

Your best choice !

Spec

  • Use : Packing,Wood & Paper Working

Key Features

Hot melt glue chips for Packaging
  • Applications: for box foaming, carton sealing.
  • Bond to wide range of tough substrates.
  • Wide range of service temperature.
  • No odor, no smoke.
  • No stringing, no adhesive built-up and no charring.
  • No clogging lines.
  • Consistent in color and viscosity, crystal clear after melting.
  • Less equipment maintenance and unexpected downtime. 
Hot melt glue chips for bookbinding
  • Applications: Spine glue and Side glue
  • Spine glue: Aggressive in adhesion, good for offset paper and coated stock, particularly for those hard to stick surfaces such as clay and end grain.
  • Side glue: For a variety of cover stocks.

Please feel free to contact with us for your specific requirement. 

E-mail: charo@gaden.com.tw

Last Update : 2020-08-13
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Ms.Charo Hsieh , GADEN CORPORATION

USD
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File formats: htm, html, doc, docx, pdf, txt, jpg, gif, png, odt, ods. Max 3 files (10MB in total).

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