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Blind & Buried Vias 8 layers

Model No.
Blind & Buried Vias
Supplier
GLOCOM ELECTRONICS LTD.More About This Product
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Key Features

Multilayer PCB: 8 layers
Material: FR4
Copper weight: 1oz
Total thickness: 1.6mm
Panel size: 508 x 600mm
Surface finishing: HASL
Solder mask type: liquid photo imageable
Profiling: NC routing


Last Update : 2017-12-13
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